Rumor mill: New retail packaging for Intel’s Eleventh-gen Rocket Lake CPUs has been noticed within the wild and stands out from earlier iterations. The exhausting plastic containers have an odd form that may stand out on cabinets, which Intel possible hopes will improve hype round a era of chips they have to be profitable.
Intel Rocket Lake CPUs are slated to launch subsequent month. A brand new leak from VideoCardz has revealed the packing we are able to anticipate to come back with the top-of-the-line Core i9 chips. Based mostly on the leaked photographs, the brand new packaging is made fully, or no less than largely, of exhausting plastic with opaque deep Intel blue on the back and front faces and translucent child blue home windows on the perimeters. The field appears to be like like 4 trapezoids stacked front-to-back to offer a glance that ought to stand out from the pack.
Intel’s tenth gen packaging featured a small acrylic window and harkened again to the oblong field design of eighth gen and earlier. This new field is extra according to the stand-out-in-a-crowd perspective that fed the design of the i9-9900k two years in the past.
In accordance with the leak, apparently the i9-11900KF shall be given the same old cube-shaped therapy, so the exhausting plastic field that may invariably function wall-hangings for a lot of tech youtubers shall be restricted to solely essentially the most fanatic consumers.
Rocket Lake shall be one more launch on the 14nm course of node, backported from the brand new Sunny Cove structure, which suggests it can see a lot of enhancements and as much as 5.3GHz peak enhance. That mentioned, the core counts on these playing cards look to path behind AMD’s present providing and Intel will want Rocket Lake to be successful as they work to repair their course of node points.
This new packaging will both rejoice a speedy new chip or attempt to gin up some curiosity (bear in mind the Marvel-themed Intel packaging?) in an organization below duress.